Modeling of electromigration induced contact resistance reduction of Cu-Cu bonded interface

Riko I. Made, Chee Lip Gan, Chuan Seng Tan

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Fingerprint

Dive into the research topics of 'Modeling of electromigration induced contact resistance reduction of Cu-Cu bonded interface'. Together they form a unique fingerprint.

Keyphrases

Material Science