Multi-via electromigration test structures for identification and characterization of different failure mechanisms

Z. S. Choi*, C. W. Chang, J. H. Lee, C. L. Gan, C. V. Thompson, K. L. Pey, W. K. Choi

*Corresponding author for this work

Research output: Contribution to journal › Conference article › peer-review

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Material Science

Economics, Econometrics and Finance

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Engineering