New mechanisms of void growth in Au-Al wire bonds: Volumetric shrinkage and intermetallic oxidation

H. Xu; C. Liu; V. V. Silberschmidt; S. S. Pramana; T. J. White; Z. Chenc; V. L. Acoffa

doi:10.1016/j.scriptamat.2011.06.050

New mechanisms of void growth in Au-Al wire bonds: Volumetric shrinkage and intermetallic oxidation

H. Xu^*, C. Liu, V. V. Silberschmidt, S. S. Pramana, T. J. White, Z. Chenc, V. L. Acoffa

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

35 Citations (Scopus)

Abstract

This letter examines void nucleation and coalescence in Au-Al wire bonds using high-resolution transmission electron microscopy. It is found that void formation is not only attributed to Kirkendall-type migration as conventionally believed, but also due to volumetric shrinkage and intermetallic oxidation. A volumetric shrinkage of a few percent is associated with intermetallic growth and phase transformations. Intermetallic oxidation occurs at the intermetallics/alumina interface and the migration of oxygen towards the intermetallics leads to void growth and thickening of the surrounding oxide walls.

Original language	English
Pages (from-to)	642-645
Number of pages	4
Journal	Scripta Materialia
Volume	65
Issue number	7
DOIs	https://doi.org/10.1016/j.scriptamat.2011.06.050
Publication status	Published - Oct 2011
Externally published	Yes

ASJC Scopus Subject Areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

Keywords

Intermetallic compounds
Oxidation
Transmission electron microscopy (TEM)
Void
Wire bonding

Access to Document

10.1016/j.scriptamat.2011.06.050

Cite this

@article{82fa708dfb3d4b9080b7bd1e63bf9e5b,

title = "New mechanisms of void growth in Au-Al wire bonds: Volumetric shrinkage and intermetallic oxidation",

abstract = "This letter examines void nucleation and coalescence in Au-Al wire bonds using high-resolution transmission electron microscopy. It is found that void formation is not only attributed to Kirkendall-type migration as conventionally believed, but also due to volumetric shrinkage and intermetallic oxidation. A volumetric shrinkage of a few percent is associated with intermetallic growth and phase transformations. Intermetallic oxidation occurs at the intermetallics/alumina interface and the migration of oxygen towards the intermetallics leads to void growth and thickening of the surrounding oxide walls.",

keywords = "Intermetallic compounds, Oxidation, Transmission electron microscopy (TEM), Void, Wire bonding",

author = "H. Xu and C. Liu and Silberschmidt, {V. V.} and Pramana, {S. S.} and White, {T. J.} and Z. Chenc and Acoffa, {V. L.}",

year = "2011",

month = oct,

doi = "10.1016/j.scriptamat.2011.06.050",

language = "English",

volume = "65",

pages = "642--645",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Acta Materialia Inc",

number = "7",

}

TY - JOUR

T1 - New mechanisms of void growth in Au-Al wire bonds

T2 - Volumetric shrinkage and intermetallic oxidation

AU - Xu, H.

AU - Liu, C.

AU - Silberschmidt, V. V.

AU - Pramana, S. S.

AU - White, T. J.

AU - Chenc, Z.

AU - Acoffa, V. L.

PY - 2011/10

Y1 - 2011/10

N2 - This letter examines void nucleation and coalescence in Au-Al wire bonds using high-resolution transmission electron microscopy. It is found that void formation is not only attributed to Kirkendall-type migration as conventionally believed, but also due to volumetric shrinkage and intermetallic oxidation. A volumetric shrinkage of a few percent is associated with intermetallic growth and phase transformations. Intermetallic oxidation occurs at the intermetallics/alumina interface and the migration of oxygen towards the intermetallics leads to void growth and thickening of the surrounding oxide walls.

AB - This letter examines void nucleation and coalescence in Au-Al wire bonds using high-resolution transmission electron microscopy. It is found that void formation is not only attributed to Kirkendall-type migration as conventionally believed, but also due to volumetric shrinkage and intermetallic oxidation. A volumetric shrinkage of a few percent is associated with intermetallic growth and phase transformations. Intermetallic oxidation occurs at the intermetallics/alumina interface and the migration of oxygen towards the intermetallics leads to void growth and thickening of the surrounding oxide walls.

KW - Intermetallic compounds

KW - Oxidation

KW - Transmission electron microscopy (TEM)

KW - Void

KW - Wire bonding

UR - http://www.scopus.com/inward/record.url?scp=84861512070&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84861512070&partnerID=8YFLogxK

U2 - 10.1016/j.scriptamat.2011.06.050

DO - 10.1016/j.scriptamat.2011.06.050

M3 - Article

AN - SCOPUS:84861512070

SN - 1359-6462

VL - 65

SP - 642

EP - 645

JO - Scripta Materialia

JF - Scripta Materialia

IS - 7

ER -

New mechanisms of void growth in Au-Al wire bonds: Volumetric shrinkage and intermetallic oxidation

Abstract

ASJC Scopus Subject Areas

Keywords

Access to Document

Other files and links

Fingerprint

Cite this