On the use of Physics in Machine Learning for Manufacturing Process Inspection

George Barbastathis, Qihang Zhang, Ajinkya Pandit, Wenlong Tang*, Charles Papageorgiou, Richard D. Braatz, Allan S. Myerson, Bingyao Tan*, Leopold Schmetterer*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We discuss the use of machine learning in computational imaging for manufacturing process inspection and control. In a recent article1 we described a physics-enhanced auto-correlation based estimator (Peace) for quantitative speckle. We derived an explicit forward relationship between the particle size distribution (PSD) and the speckle autocorrelation for particle sizes significantly larger than the wavelength (×100 „ ×1,000). We subsequently trained a machine learning kernel to invert the autocorrelation and obtain the PSD, using the explicit forward model to reduce the number of experimentally acquired examples. In this talk, we present an expanded discussion of Peace and its properties, including spatial and temporal sampling and accuracy, and more general applications.

Original languageEnglish
Title of host publicationOptical Methods for Inspection, Characterization, and Imaging of Biomaterials VI
EditorsPietro Ferraro, Demetri Psaltis, Simonetta Grilli
PublisherSPIE
ISBN (Electronic)9781510664531
DOIs
Publication statusPublished - 2023
Externally publishedYes
EventOptical Methods for Inspection, Characterization, and Imaging of Biomaterials VI 2023 - Munich, Germany
Duration: Jun 26 2023Jun 29 2023

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume12622
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceOptical Methods for Inspection, Characterization, and Imaging of Biomaterials VI 2023
Country/TerritoryGermany
CityMunich
Period6/26/236/29/23

Bibliographical note

Publisher Copyright:
© 2023 SPIE. All rights reserved.

ASJC Scopus Subject Areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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