Organic FETs with HWCVD silicon nitride as a passivation layer and gate dielectric

S. P. Tiwari, P. Srinivas, S. Shriram, Nitin S. Kale, S. G. Mhaisalkar, V. Ramgopal Rao*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

29 Citations (Scopus)

Abstract

This paper reports the use of hot-wire chemical vapour deposited (HWCVD) Silicon nitride as a passivation layer for Organic Field Effect Transistors (OFETs). Firstly, the degradation study of the OFETs is done with time. A thin (10-20 nm) layer of silicon nitride is deposited on the OFETs, at a low temperature (< 90 °C) by HWCVD process, to passivate them from the ambient. Our results show that this technique is very effective in improving the stability of the organic semiconductors (Poly-3-hexyl thiophene (P3HT) is used as a test case in this study). This HWCVD deposited nitride can also be used as a gate dielectric material for the study of OFETs because of its higher dielectric constant and significantly less hydrogen content.

Original languageEnglish
Pages (from-to)770-772
Number of pages3
JournalThin Solid Films
Volume516
Issue number5
DOIs
Publication statusPublished - Jan 15 2008
Externally publishedYes

ASJC Scopus Subject Areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Keywords

  • HWCVD
  • Mobility
  • ON/OFF ratio
  • Organic Field Effect Transistor (OFET)
  • Passivation

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