Abstract
This paper reports the use of hot-wire chemical vapour deposited (HWCVD) Silicon nitride as a passivation layer for Organic Field Effect Transistors (OFETs). Firstly, the degradation study of the OFETs is done with time. A thin (10-20 nm) layer of silicon nitride is deposited on the OFETs, at a low temperature (< 90 °C) by HWCVD process, to passivate them from the ambient. Our results show that this technique is very effective in improving the stability of the organic semiconductors (Poly-3-hexyl thiophene (P3HT) is used as a test case in this study). This HWCVD deposited nitride can also be used as a gate dielectric material for the study of OFETs because of its higher dielectric constant and significantly less hydrogen content.
Original language | English |
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Pages (from-to) | 770-772 |
Number of pages | 3 |
Journal | Thin Solid Films |
Volume | 516 |
Issue number | 5 |
DOIs | |
Publication status | Published - Jan 15 2008 |
Externally published | Yes |
ASJC Scopus Subject Areas
- Electronic, Optical and Magnetic Materials
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Metals and Alloys
- Materials Chemistry
Keywords
- HWCVD
- Mobility
- ON/OFF ratio
- Organic Field Effect Transistor (OFET)
- Passivation