Oxygen-Based Microwave Induced Plasma Etching for Epoxy Molding Compound Removal in Advanced Semiconductor Devices

Hong Siang Tan; Bernice Zee; Chee Lip Gan; Katherine Kor; Jiaqi Tang; Mark McKinnon

doi:10.1109/IPFA58228.2023.10249167

Oxygen-Based Microwave Induced Plasma Etching for Epoxy Molding Compound Removal in Advanced Semiconductor Devices

Hong Siang Tan^*, Bernice Zee, Chee Lip Gan, Katherine Kor, Jiaqi Tang, Mark McKinnon

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Heterogenous integration has led to the development of advanced semiconductor packages with better performance and smaller form factor. Such packages usually comprise of multiple dies and embedded components which are encapsulated with epoxy molding compounds (EMCs) to improve the reliability performance and to protect the die from external impact. However, this increases the difficulty of failure analysis (FA) as the defects may manifest in the embedded components that are covered by EMCs. Suitable sample preparation techniques and workflows are required to remove EMCs to reveal the defects to determine the root cause of failure. This paper explores the use of microwave induced plasma (MIP) etcher to remove EMCs. Tool parameters are varied to understand their effects on the removal rate of EMCs such as underfill.

Original language	English
Title of host publication	2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9798350301649
DOIs	https://doi.org/10.1109/IPFA58228.2023.10249167
Publication status	Published - 2023
Externally published	Yes
Event	2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023 - Pulau Pinang, Malaysia Duration: Jul 24 2023 → Jul 27 2023

Publication series

Name	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Volume	2023-July

Conference

Conference	2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023
Country/Territory	Malaysia
City	Pulau Pinang
Period	7/24/23 → 7/27/23

Bibliographical note

Publisher Copyright:
© 2023 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Keywords

Epoxy Molding Compounds
Microwave Induced Plasma (MIP)

Access to Document

10.1109/IPFA58228.2023.10249167

Cite this

Tan, H. S., Zee, B., Gan, C. L., Kor, K., Tang, J., & McKinnon, M. (2023). Oxygen-Based Microwave Induced Plasma Etching for Epoxy Molding Compound Removal in Advanced Semiconductor Devices. In 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; Vol. 2023-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPFA58228.2023.10249167

Tan, Hong Siang ; Zee, Bernice ; Gan, Chee Lip et al. / Oxygen-Based Microwave Induced Plasma Etching for Epoxy Molding Compound Removal in Advanced Semiconductor Devices. 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023. Institute of Electrical and Electronics Engineers Inc., 2023. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

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title = "Oxygen-Based Microwave Induced Plasma Etching for Epoxy Molding Compound Removal in Advanced Semiconductor Devices",

abstract = "Heterogenous integration has led to the development of advanced semiconductor packages with better performance and smaller form factor. Such packages usually comprise of multiple dies and embedded components which are encapsulated with epoxy molding compounds (EMCs) to improve the reliability performance and to protect the die from external impact. However, this increases the difficulty of failure analysis (FA) as the defects may manifest in the embedded components that are covered by EMCs. Suitable sample preparation techniques and workflows are required to remove EMCs to reveal the defects to determine the root cause of failure. This paper explores the use of microwave induced plasma (MIP) etcher to remove EMCs. Tool parameters are varied to understand their effects on the removal rate of EMCs such as underfill.",

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year = "2023",

doi = "10.1109/IPFA58228.2023.10249167",

language = "English",

series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",

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Tan, HS, Zee, B, Gan, CL, Kor, K, Tang, J & McKinnon, M 2023, Oxygen-Based Microwave Induced Plasma Etching for Epoxy Molding Compound Removal in Advanced Semiconductor Devices. in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023. Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, vol. 2023-July, Institute of Electrical and Electronics Engineers Inc., 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023, Pulau Pinang, Malaysia, 7/24/23. https://doi.org/10.1109/IPFA58228.2023.10249167

Oxygen-Based Microwave Induced Plasma Etching for Epoxy Molding Compound Removal in Advanced Semiconductor Devices. / Tan, Hong Siang; Zee, Bernice; Gan, Chee Lip et al.
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023. Institute of Electrical and Electronics Engineers Inc., 2023. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; Vol. 2023-July).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - Oxygen-Based Microwave Induced Plasma Etching for Epoxy Molding Compound Removal in Advanced Semiconductor Devices

AU - Tan, Hong Siang

AU - Zee, Bernice

AU - Gan, Chee Lip

AU - Kor, Katherine

AU - Tang, Jiaqi

AU - McKinnon, Mark

PY - 2023

Y1 - 2023

N2 - Heterogenous integration has led to the development of advanced semiconductor packages with better performance and smaller form factor. Such packages usually comprise of multiple dies and embedded components which are encapsulated with epoxy molding compounds (EMCs) to improve the reliability performance and to protect the die from external impact. However, this increases the difficulty of failure analysis (FA) as the defects may manifest in the embedded components that are covered by EMCs. Suitable sample preparation techniques and workflows are required to remove EMCs to reveal the defects to determine the root cause of failure. This paper explores the use of microwave induced plasma (MIP) etcher to remove EMCs. Tool parameters are varied to understand their effects on the removal rate of EMCs such as underfill.

AB - Heterogenous integration has led to the development of advanced semiconductor packages with better performance and smaller form factor. Such packages usually comprise of multiple dies and embedded components which are encapsulated with epoxy molding compounds (EMCs) to improve the reliability performance and to protect the die from external impact. However, this increases the difficulty of failure analysis (FA) as the defects may manifest in the embedded components that are covered by EMCs. Suitable sample preparation techniques and workflows are required to remove EMCs to reveal the defects to determine the root cause of failure. This paper explores the use of microwave induced plasma (MIP) etcher to remove EMCs. Tool parameters are varied to understand their effects on the removal rate of EMCs such as underfill.

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KW - Microwave Induced Plasma (MIP)

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Tan HS, Zee B, Gan CL, Kor K, Tang J, McKinnon M. Oxygen-Based Microwave Induced Plasma Etching for Epoxy Molding Compound Removal in Advanced Semiconductor Devices. In 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023. Institute of Electrical and Electronics Engineers Inc. 2023. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). doi: 10.1109/IPFA58228.2023.10249167

Oxygen-Based Microwave Induced Plasma Etching for Epoxy Molding Compound Removal in Advanced Semiconductor Devices

Abstract

Publication series

Conference

Bibliographical note

ASJC Scopus Subject Areas

Keywords

Access to Document

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