TY - JOUR
T1 - Rapid Copper Metallization of Textile Materials
T2 - a Controlled Two-Step Route to Achieve User-Defined Patterns under Ambient Conditions
AU - Zhang, Shuang Yuan
AU - Guan, Guijian
AU - Jiang, Shan
AU - Guo, Hongchen
AU - Xia, Jing
AU - Regulacio, Michelle D.
AU - Wu, Mingda
AU - Shah, Kwok Wei
AU - Dong, Zhili
AU - Zhang, Jie
AU - Han, Ming Yong
N1 - Publisher Copyright:
© 2015 American Chemical Society.
PY - 2015/9/30
Y1 - 2015/9/30
N2 - Throughout history earth-abundant copper has been incorporated into textiles and it still caters to various needs in modern society. In this paper, we present a two-step copper metallization strategy to realize sequentially nondiffusive copper(II) patterning and rapid copper deposition on various textile materials, including cotton, polyester, nylon, and their mixtures. A new, cost-effective formulation is designed to minimize the copper pattern migration on textiles and to achieve user-defined copper patterns. The metallized copper is found to be very adhesive and stable against washing and oxidation. Furthermore, the copper-metallized textile exhibits excellent electrical conductivity that is 3 times better than that of stainless steel and also inhibits the growth of bacteria effectively. This new copper metallization approach holds great promise as a commercially viable method to metallize an insulating textile, opening up research avenues for wearable electronics and functional garments.
AB - Throughout history earth-abundant copper has been incorporated into textiles and it still caters to various needs in modern society. In this paper, we present a two-step copper metallization strategy to realize sequentially nondiffusive copper(II) patterning and rapid copper deposition on various textile materials, including cotton, polyester, nylon, and their mixtures. A new, cost-effective formulation is designed to minimize the copper pattern migration on textiles and to achieve user-defined copper patterns. The metallized copper is found to be very adhesive and stable against washing and oxidation. Furthermore, the copper-metallized textile exhibits excellent electrical conductivity that is 3 times better than that of stainless steel and also inhibits the growth of bacteria effectively. This new copper metallization approach holds great promise as a commercially viable method to metallize an insulating textile, opening up research avenues for wearable electronics and functional garments.
KW - autocatalytic plating
KW - chemical plating
KW - electroless copper plating
KW - textile metallization
KW - wearable electronics
UR - http://www.scopus.com/inward/record.url?scp=84942871229&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84942871229&partnerID=8YFLogxK
U2 - 10.1021/acsami.5b06807
DO - 10.1021/acsami.5b06807
M3 - Article
C2 - 26361094
AN - SCOPUS:84942871229
SN - 1944-8244
VL - 7
SP - 21545
EP - 21551
JO - ACS Applied Materials and Interfaces
JF - ACS Applied Materials and Interfaces
IS - 38
ER -