Role of Silica-Epoxy Interface and Deep Traps on the Dielectric Breakdown Performance of Epoxy Moulding Compounds (EMC)

Lin Xiao Chua; Hui Qin Woo; Khai Seen Yong; Wu Hu Li; Lay Poh Tan; Chee Lip Gan

doi:10.1109/EPTC56328.2022.10013219

Role of Silica-Epoxy Interface and Deep Traps on the Dielectric Breakdown Performance of Epoxy Moulding Compounds (EMC)

Lin Xiao Chua^*, Hui Qin Woo, Khai Seen Yong, Wu Hu Li, Lay Poh Tan, Chee Lip Gan

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

In this paper, the properties of silica-epoxy interface and effect of deep traps on the dielectric breakdown performance of Epoxy Moulding Compounds (EMC) were investigated to address the lack of understanding on how the higher voltages and frequencies, affect the encapsulation material of the devices. The interfacial properties, trap properties and dielectric breakdown strength of EMC formulations modified by a type of coupling agent, named AS, were studied. This paper found that the improvement in filler dispersion (i.e. a reduction of filler aggregation rate and an improvement of filler size distribution) and the increase in deep trap depth and density could improve the AC dielectric breakdown strength. The changes in the silica-epoxy interface via the addition of AS can be explained using the Maxwell-Wagner-Sillars (MWS) polarisation mechanism. EMC with 100% AS-treated silica was found to have the best dielectric breakdown performance due to its high dielectric breakdown strength of 21.41\pm 0.20\ kV/mm measured.

Original language	English
Title of host publication	Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	555-562
Number of pages	8
ISBN (Electronic)	9798350398854
DOIs	https://doi.org/10.1109/EPTC56328.2022.10013219
Publication status	Published - 2022
Externally published	Yes
Event	24th Electronics Packaging Technology Conference, EPTC 2022 - Singapore, Singapore Duration: Dec 7 2022 → Dec 9 2022

Publication series

Name	Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022

Conference

Conference	24th Electronics Packaging Technology Conference, EPTC 2022
Country/Territory	Singapore
City	Singapore
Period	12/7/22 → 12/9/22

Bibliographical note

Publisher Copyright:
© 2022 IEEE.

ASJC Scopus Subject Areas

Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials
Fluid Flow and Transfer Processes
Process Chemistry and Technology
Electrical and Electronic Engineering
Industrial and Manufacturing Engineering

Access to Document

10.1109/EPTC56328.2022.10013219

Cite this

Chua, L. X., Woo, H. Q., Yong, K. S., Li, W. H., Tan, L. P., & Gan, C. L. (2022). Role of Silica-Epoxy Interface and Deep Traps on the Dielectric Breakdown Performance of Epoxy Moulding Compounds (EMC). In Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 (pp. 555-562). (Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC56328.2022.10013219

Chua, Lin Xiao ; Woo, Hui Qin ; Yong, Khai Seen et al. / Role of Silica-Epoxy Interface and Deep Traps on the Dielectric Breakdown Performance of Epoxy Moulding Compounds (EMC). Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022. Institute of Electrical and Electronics Engineers Inc., 2022. pp. 555-562 (Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022).

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title = "Role of Silica-Epoxy Interface and Deep Traps on the Dielectric Breakdown Performance of Epoxy Moulding Compounds (EMC)",

abstract = "In this paper, the properties of silica-epoxy interface and effect of deep traps on the dielectric breakdown performance of Epoxy Moulding Compounds (EMC) were investigated to address the lack of understanding on how the higher voltages and frequencies, affect the encapsulation material of the devices. The interfacial properties, trap properties and dielectric breakdown strength of EMC formulations modified by a type of coupling agent, named AS, were studied. This paper found that the improvement in filler dispersion (i.e. a reduction of filler aggregation rate and an improvement of filler size distribution) and the increase in deep trap depth and density could improve the AC dielectric breakdown strength. The changes in the silica-epoxy interface via the addition of AS can be explained using the Maxwell-Wagner-Sillars (MWS) polarisation mechanism. EMC with 100% AS-treated silica was found to have the best dielectric breakdown performance due to its high dielectric breakdown strength of 21.41\pm 0.20\ kV/mm measured.",

author = "Chua, {Lin Xiao} and Woo, {Hui Qin} and Yong, {Khai Seen} and Li, {Wu Hu} and Tan, {Lay Poh} and Gan, {Chee Lip}",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 24th Electronics Packaging Technology Conference, EPTC 2022 ; Conference date: 07-12-2022 Through 09-12-2022",

year = "2022",

doi = "10.1109/EPTC56328.2022.10013219",

language = "English",

series = "Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022",

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Chua, LX, Woo, HQ, Yong, KS, Li, WH, Tan, LP & Gan, CL 2022, Role of Silica-Epoxy Interface and Deep Traps on the Dielectric Breakdown Performance of Epoxy Moulding Compounds (EMC). in Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022. Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022, Institute of Electrical and Electronics Engineers Inc., pp. 555-562, 24th Electronics Packaging Technology Conference, EPTC 2022, Singapore, Singapore, 12/7/22. https://doi.org/10.1109/EPTC56328.2022.10013219

Role of Silica-Epoxy Interface and Deep Traps on the Dielectric Breakdown Performance of Epoxy Moulding Compounds (EMC). / Chua, Lin Xiao; Woo, Hui Qin; Yong, Khai Seen et al.
Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022. Institute of Electrical and Electronics Engineers Inc., 2022. p. 555-562 (Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Woo, Hui Qin

AU - Yong, Khai Seen

AU - Li, Wu Hu

AU - Tan, Lay Poh

AU - Gan, Chee Lip

PY - 2022

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N2 - In this paper, the properties of silica-epoxy interface and effect of deep traps on the dielectric breakdown performance of Epoxy Moulding Compounds (EMC) were investigated to address the lack of understanding on how the higher voltages and frequencies, affect the encapsulation material of the devices. The interfacial properties, trap properties and dielectric breakdown strength of EMC formulations modified by a type of coupling agent, named AS, were studied. This paper found that the improvement in filler dispersion (i.e. a reduction of filler aggregation rate and an improvement of filler size distribution) and the increase in deep trap depth and density could improve the AC dielectric breakdown strength. The changes in the silica-epoxy interface via the addition of AS can be explained using the Maxwell-Wagner-Sillars (MWS) polarisation mechanism. EMC with 100% AS-treated silica was found to have the best dielectric breakdown performance due to its high dielectric breakdown strength of 21.41\pm 0.20\ kV/mm measured.

AB - In this paper, the properties of silica-epoxy interface and effect of deep traps on the dielectric breakdown performance of Epoxy Moulding Compounds (EMC) were investigated to address the lack of understanding on how the higher voltages and frequencies, affect the encapsulation material of the devices. The interfacial properties, trap properties and dielectric breakdown strength of EMC formulations modified by a type of coupling agent, named AS, were studied. This paper found that the improvement in filler dispersion (i.e. a reduction of filler aggregation rate and an improvement of filler size distribution) and the increase in deep trap depth and density could improve the AC dielectric breakdown strength. The changes in the silica-epoxy interface via the addition of AS can be explained using the Maxwell-Wagner-Sillars (MWS) polarisation mechanism. EMC with 100% AS-treated silica was found to have the best dielectric breakdown performance due to its high dielectric breakdown strength of 21.41\pm 0.20\ kV/mm measured.

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BT - Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022

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ER -

Chua LX, Woo HQ, Yong KS, Li WH, Tan LP, Gan CL. Role of Silica-Epoxy Interface and Deep Traps on the Dielectric Breakdown Performance of Epoxy Moulding Compounds (EMC). In Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022. Institute of Electrical and Electronics Engineers Inc. 2022. p. 555-562. (Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022). doi: 10.1109/EPTC56328.2022.10013219

Role of Silica-Epoxy Interface and Deep Traps on the Dielectric Breakdown Performance of Epoxy Moulding Compounds (EMC)

Abstract

Publication series

Conference

Bibliographical note

ASJC Scopus Subject Areas

Access to Document

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