Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment

Y. S. Tay; L. Yang; H. Zhang; H. B. Kor; L. Zhang; H. Liu; V. Gill; A. Lambourne; K. H.H. Li; Z. Chen; C. L. Gan

doi:10.1016/j.microrel.2023.115115

Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment

Y. S. Tay, L. Yang, H. Zhang, H. B. Kor, L. Zhang, H. Liu, V. Gill, A. Lambourne, K. H.H. Li, Z. Chen, C. L. Gan^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

Current gas sensors are typically graded for performance up to 100 °C and limited by the materials used in their packaging. This work aims to select, design and investigate novel materials for die attach and encapsulation technology, such as copper nanoparticles-based die attach and phthalonitrile-based encapsulant, for the fabrication of a packaged gas sensor for harsh environment applications. This is done through a series of test protocols and reliability assessments developed to simulate operations at high temperature and under strong vibration.

Original language	English
Article number	115115
Journal	Microelectronics Reliability
Volume	150
DOIs	https://doi.org/10.1016/j.microrel.2023.115115
Publication status	Published - Nov 2023
Externally published	Yes

Bibliographical note

Publisher Copyright:
© 2023

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Safety, Risk, Reliability and Quality
Surfaces, Coatings and Films
Electrical and Electronic Engineering

Keywords

High-temperature vibration fatigue
NanoCu die attach
Phthalonitrile-based encapsulant
Thermal cycling
Vibration sweep

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10.1016/j.microrel.2023.115115

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title = "Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment",

abstract = "Current gas sensors are typically graded for performance up to 100 °C and limited by the materials used in their packaging. This work aims to select, design and investigate novel materials for die attach and encapsulation technology, such as copper nanoparticles-based die attach and phthalonitrile-based encapsulant, for the fabrication of a packaged gas sensor for harsh environment applications. This is done through a series of test protocols and reliability assessments developed to simulate operations at high temperature and under strong vibration.",

keywords = "High-temperature vibration fatigue, NanoCu die attach, Phthalonitrile-based encapsulant, Thermal cycling, Vibration sweep",

author = "Tay, {Y. S.} and L. Yang and H. Zhang and Kor, {H. B.} and L. Zhang and H. Liu and V. Gill and A. Lambourne and Li, {K. H.H.} and Z. Chen and Gan, {C. L.}",

note = "Publisher Copyright: {\textcopyright} 2023",

year = "2023",

month = nov,

doi = "10.1016/j.microrel.2023.115115",

language = "English",

volume = "150",

journal = "Microelectronics Reliability",

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TY - JOUR

T1 - Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment

AU - Tay, Y. S.

AU - Yang, L.

AU - Zhang, H.

AU - Kor, H. B.

AU - Zhang, L.

AU - Liu, H.

AU - Gill, V.

AU - Lambourne, A.

AU - Li, K. H.H.

AU - Chen, Z.

AU - Gan, C. L.

PY - 2023/11

Y1 - 2023/11

N2 - Current gas sensors are typically graded for performance up to 100 °C and limited by the materials used in their packaging. This work aims to select, design and investigate novel materials for die attach and encapsulation technology, such as copper nanoparticles-based die attach and phthalonitrile-based encapsulant, for the fabrication of a packaged gas sensor for harsh environment applications. This is done through a series of test protocols and reliability assessments developed to simulate operations at high temperature and under strong vibration.

AB - Current gas sensors are typically graded for performance up to 100 °C and limited by the materials used in their packaging. This work aims to select, design and investigate novel materials for die attach and encapsulation technology, such as copper nanoparticles-based die attach and phthalonitrile-based encapsulant, for the fabrication of a packaged gas sensor for harsh environment applications. This is done through a series of test protocols and reliability assessments developed to simulate operations at high temperature and under strong vibration.

KW - High-temperature vibration fatigue

KW - NanoCu die attach

KW - Phthalonitrile-based encapsulant

KW - Thermal cycling

KW - Vibration sweep

UR - http://www.scopus.com/inward/record.url?scp=85174682134&partnerID=8YFLogxK

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DO - 10.1016/j.microrel.2023.115115

M3 - Article

AN - SCOPUS:85174682134

SN - 0026-2714

VL - 150

JO - Microelectronics Reliability

JF - Microelectronics Reliability

M1 - 115115

ER -

Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment

Abstract

Bibliographical note

ASJC Scopus Subject Areas

Keywords

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