Sample Preparation for Deprocessing of 3D Multi-Die Stacked Package

H. B. Kor; Q. Liu; C. L. Gan

doi:10.1109/IPFA49335.2020.9260707

Sample Preparation for Deprocessing of 3D Multi-Die Stacked Package

H. B. Kor^*, Q. Liu, C. L. Gan

^*Corresponding author for this work

Nanyang Technological University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

3D packaging consists of a variety of architectures and types. Fault isolation and physical failure analysis (PFA) can involve non-destructive and destructive techniques. Previously, decapsulation techniques to gain access to individual dice in a 3D multi-die stacked package with very thin dice (100 μm) had been investigated. This paper introduces the sample preparation techniques required for the deprocessing of a thin die within the 3D multi-die stacked package.

Original language	English
Title of host publication	2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2020
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728161693
DOIs	https://doi.org/10.1109/IPFA49335.2020.9260707
Publication status	Published - Jul 20 2020
Externally published	Yes
Event	2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2020 - Singapore, Singapore Duration: Jul 20 2020 → Jul 23 2020

Publication series

Name	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Volume	2020-July

Conference

Conference	2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2020
Country/Territory	Singapore
City	Singapore
Period	7/20/20 → 7/23/20

Bibliographical note

Publisher Copyright:
© 2020 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Keywords

3D stacked-die packages
deprocessing
physical failure analysis
sample preparation
thin die

Access to Document

10.1109/IPFA49335.2020.9260707

Cite this

Kor, H. B., Liu, Q., & Gan, C. L. (2020). Sample Preparation for Deprocessing of 3D Multi-Die Stacked Package. In 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2020 Article 9260707 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; Vol. 2020-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPFA49335.2020.9260707

Kor, H. B. ; Liu, Q. ; Gan, C. L. / Sample Preparation for Deprocessing of 3D Multi-Die Stacked Package. 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2020. Institute of Electrical and Electronics Engineers Inc., 2020. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

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title = "Sample Preparation for Deprocessing of 3D Multi-Die Stacked Package",

abstract = "3D packaging consists of a variety of architectures and types. Fault isolation and physical failure analysis (PFA) can involve non-destructive and destructive techniques. Previously, decapsulation techniques to gain access to individual dice in a 3D multi-die stacked package with very thin dice (100 μm) had been investigated. This paper introduces the sample preparation techniques required for the deprocessing of a thin die within the 3D multi-die stacked package.",

keywords = "3D stacked-die packages, deprocessing, physical failure analysis, sample preparation, thin die",

author = "Kor, {H. B.} and Q. Liu and Gan, {C. L.}",

note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2020 ; Conference date: 20-07-2020 Through 23-07-2020",

year = "2020",

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doi = "10.1109/IPFA49335.2020.9260707",

language = "English",

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Kor, HB, Liu, Q & Gan, CL 2020, Sample Preparation for Deprocessing of 3D Multi-Die Stacked Package. in 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2020., 9260707, Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, vol. 2020-July, Institute of Electrical and Electronics Engineers Inc., 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2020, Singapore, Singapore, 7/20/20. https://doi.org/10.1109/IPFA49335.2020.9260707

Sample Preparation for Deprocessing of 3D Multi-Die Stacked Package. / Kor, H. B.; Liu, Q.; Gan, C. L.
2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9260707 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; Vol. 2020-July).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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PY - 2020/7/20

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N2 - 3D packaging consists of a variety of architectures and types. Fault isolation and physical failure analysis (PFA) can involve non-destructive and destructive techniques. Previously, decapsulation techniques to gain access to individual dice in a 3D multi-die stacked package with very thin dice (100 μm) had been investigated. This paper introduces the sample preparation techniques required for the deprocessing of a thin die within the 3D multi-die stacked package.

AB - 3D packaging consists of a variety of architectures and types. Fault isolation and physical failure analysis (PFA) can involve non-destructive and destructive techniques. Previously, decapsulation techniques to gain access to individual dice in a 3D multi-die stacked package with very thin dice (100 μm) had been investigated. This paper introduces the sample preparation techniques required for the deprocessing of a thin die within the 3D multi-die stacked package.

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BT - 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2020

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Kor HB, Liu Q, Gan CL. Sample Preparation for Deprocessing of 3D Multi-Die Stacked Package. In 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2020. Institute of Electrical and Electronics Engineers Inc. 2020. 9260707. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). doi: 10.1109/IPFA49335.2020.9260707

Sample Preparation for Deprocessing of 3D Multi-Die Stacked Package

Abstract

Publication series

Conference

Bibliographical note

ASJC Scopus Subject Areas

Keywords

Access to Document

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Cite this