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Self-aligned metal capping layers for copper interconnects using electroless plating
J. Gambino*, J. Wynne, J. Gill, S. Mongeon, D. Meatyard, B. Lee, H. Bamnolker, L. Hall, N. Li, M. Hernandez, P. Little, M. Hamed, I. Ivanov, C. L. Gan
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
72
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(Scopus)