Size-effect on the electronic structure and the thermal stability of a gold nanosolid

Chang Q. Sun*, H. L. Bai, S. Li, B. K. Tay, E. Y. Jiang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

25 Citations (Scopus)

Abstract

Consistent insight into the size-enhanced E4f-level shift and the size-suppressed melting point of Au nanosolids has been obtained based on the bond order-length-strength (BOLS) correlation mechanism [Sun et al., Acta Mater. 51 (2003) 4631]. Consistency between theory predictions and observations reveals that the atomic-coordination number (CN)-imperfection induced bond contraction and the associated bond energy increase dictate these changes. The increase of binding energy density per unit volume in the relaxed surface region perturbs the Hamiltonian that determines the core-level shift; the decrease of atomic cohesive energy (a product of atomic CN and the single bond energy) determines the thermal energy required for melting. Extending the knowledge to the lower end of the size limit suggests that the metallic bond in the gold monatomic-chain contracts by ∼30% associated with ∼43% magnitude rise of the bond energy. The crystal binding intensity contributing from all the atoms in the solid to the Au-E4f electrons in the bulk is determined to be -2.87 eV.

Original languageEnglish
Pages (from-to)501-505
Number of pages5
JournalActa Materialia
Volume52
Issue number2
DOIs
Publication statusPublished - Jan 19 2004
Externally publishedYes

ASJC Scopus Subject Areas

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Polymers and Plastics
  • Metals and Alloys

Keywords

  • Electronic structure
  • Mechanical strength
  • Nanostructure
  • Thermal stability

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