Abstract
Sound field analysis based on plane-wave decomposition has been widely used in various applications. Spherical microphone arrays are usually required in three-dimensional sound field analysis; however, the three-dimensional geometry of the microphone array hinders the development for practical applications. This paper presents a sparse plane-wave decomposition method to analyze the three-dimensional sound field using a planar array instead of a spherical array. And this method is based on spherical harmonic decomposition. Both omni-directional and differential microphones are used to capture the three-dimensional sound field on a plane, which achieves the same function as spherical arrays. When the sound field is dominated by a set of plane waves, the plane-wave decomposition problem can be solved under the compressed sensing framework. Simulation results demonstrate that the proposed planar array has good reconstruction performance for plane wave sound fields.
Original language | English |
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Title of host publication | Proceedings of the 26th International Congress on Sound and Vibration, ICSV 2019 |
Publisher | Canadian Acoustical Association |
ISBN (Electronic) | 9781999181000 |
Publication status | Published - 2019 |
Externally published | Yes |
Event | 26th International Congress on Sound and Vibration, ICSV 2019 - Montreal, Canada Duration: Jul 7 2019 → Jul 11 2019 |
Publication series
Name | Proceedings of the 26th International Congress on Sound and Vibration, ICSV 2019 |
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Conference
Conference | 26th International Congress on Sound and Vibration, ICSV 2019 |
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Country/Territory | Canada |
City | Montreal |
Period | 7/7/19 → 7/11/19 |
Bibliographical note
Publisher Copyright:© Proceedings of the 26th International Congress on Sound and Vibration, ICSV 2019. All rights reserved.
ASJC Scopus Subject Areas
- Acoustics and Ultrasonics
Keywords
- Compressed sensing
- Planar microphone array
- Plane-wave decomposition
- Spherical harmonic decomposition