Statistical and physical analysis of leakage and breakdown failure mechanisms of Cu/Low-k interconnects

Tam Lyn Tan; Hui Fing Lim; Chee Lip Gan; Nam Hwang

Statistical and physical analysis of leakage and breakdown failure mechanisms of Cu/Low-k interconnects

Tam Lyn Tan^*, Hui Fing Lim, Chee Lip Gan, Nam Hwang

^*Corresponding author for this work

Research output: Contribution to conference › Paper › peer-review

Original language	English
Pages	267-270
Number of pages	4
Publication status	Published - 2005
Externally published	Yes
Event	12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2005 - Singapore, Singapore Duration: Jun 27 2005 → Jul 1 2005

Conference

Conference	12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2005
Country/Territory	Singapore
City	Singapore
Period	6/27/05 → 7/1/05

ASJC Scopus Subject Areas

General Engineering

Cite this

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title = "Statistical and physical analysis of leakage and breakdown failure mechanisms of Cu/Low-k interconnects",

author = "Tan, {Tam Lyn} and Lim, {Hui Fing} and Gan, {Chee Lip} and Nam Hwang",

year = "2005",

language = "English",

pages = "267--270",

note = "12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2005 ; Conference date: 27-06-2005 Through 01-07-2005",

}

Statistical and physical analysis of leakage and breakdown failure mechanisms of Cu/Low-k interconnects. / Tan, Tam Lyn; Lim, Hui Fing; Gan, Chee Lip et al.
2005. 267-270 Paper presented at 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2005, Singapore, Singapore.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - Statistical and physical analysis of leakage and breakdown failure mechanisms of Cu/Low-k interconnects

AU - Tan, Tam Lyn

AU - Lim, Hui Fing

AU - Gan, Chee Lip

AU - Hwang, Nam

PY - 2005

Y1 - 2005

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M3 - Paper

AN - SCOPUS:28044470466

SP - 267

EP - 270

T2 - 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2005

Y2 - 27 June 2005 through 1 July 2005

ER -

Statistical and physical analysis of leakage and breakdown failure mechanisms of Cu/Low-k interconnects

Conference

ASJC Scopus Subject Areas

Other files and links

Cite this