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Stress migration risk on electromigration reliability in advanced narrow line copper interconnects
A. Heryanto*, K. L. Pey, Y. K. Lim, N. Raghavan, W. Liu, J. Wei, C. L. Gan, J. B. Tan
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
8
Citations
(Scopus)