Study of carbon nanotube flip-chip methodology for interconnect technology via electromagnetic and circuit model approach

Christophe Brun; Yap Chin Chong; Dunlin Tan; Edwin Teo Hang Tong; Stéphane Bila; Serge Verdeyme; Dominique Baillargeat; Beng Kang Tay

doi:10.1109/MWSYM.2011.5972784

Study of carbon nanotube flip-chip methodology for interconnect technology via electromagnetic and circuit model approach

Christophe Brun^*, Yap Chin Chong, Dunlin Tan, Edwin Teo Hang Tong, Stéphane Bila, Serge Verdeyme, Dominique Baillargeat, Beng Kang Tay

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

Due to their excellent electronic and thermal properties, carbon nanotubes (CNTs) are considered as promising candidates for circuit interconnects. In this paper, we show for the first time both a theoretical and experimental analysis of CNT based flip-chip interconnects in the microwave domain. Two theoretical models of CNT were defined and compared exhibiting good agreement: one is based on electromagnetic simulations whereas the second one is based on circuit simulations. Finally, promising experimental studies were done in order to demonstrate the principle of the CNTs based flip-chip interconnect.

Original language	English
Title of host publication	2011 IEEE MTT-S International Microwave Symposium, IMS 2011
DOIs	https://doi.org/10.1109/MWSYM.2011.5972784
Publication status	Published - 2011
Externally published	Yes
Event	2011 IEEE MTT-S International Microwave Symposium, IMS 2011 - Baltimore, MD, United States Duration: Jun 5 2011 → Jun 10 2011

Publication series

Name	IEEE MTT-S International Microwave Symposium Digest
ISSN (Print)	0149-645X

Conference

Conference	2011 IEEE MTT-S International Microwave Symposium, IMS 2011
Country/Territory	United States
City	Baltimore, MD
Period	6/5/11 → 6/10/11

ASJC Scopus Subject Areas

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

Keywords

Carbon nanotubes
growth
interconnection
microwave
modeling

Access to Document

10.1109/MWSYM.2011.5972784

Cite this

Brun, C., Chong, Y. C., Tan, D., Teo Hang Tong, E., Bila, S., Verdeyme, S., Baillargeat, D., & Tay, B. K. (2011). Study of carbon nanotube flip-chip methodology for interconnect technology via electromagnetic and circuit model approach. In 2011 IEEE MTT-S International Microwave Symposium, IMS 2011 Article 5972784 (IEEE MTT-S International Microwave Symposium Digest). https://doi.org/10.1109/MWSYM.2011.5972784

@inproceedings{2937491a69614570a984864852841051,

title = "Study of carbon nanotube flip-chip methodology for interconnect technology via electromagnetic and circuit model approach",

abstract = "Due to their excellent electronic and thermal properties, carbon nanotubes (CNTs) are considered as promising candidates for circuit interconnects. In this paper, we show for the first time both a theoretical and experimental analysis of CNT based flip-chip interconnects in the microwave domain. Two theoretical models of CNT were defined and compared exhibiting good agreement: one is based on electromagnetic simulations whereas the second one is based on circuit simulations. Finally, promising experimental studies were done in order to demonstrate the principle of the CNTs based flip-chip interconnect.",

keywords = "Carbon nanotubes, growth, interconnection, microwave, modeling",

author = "Christophe Brun and Chong, {Yap Chin} and Dunlin Tan and {Teo Hang Tong}, Edwin and St{\'e}phane Bila and Serge Verdeyme and Dominique Baillargeat and Tay, {Beng Kang}",

year = "2011",

doi = "10.1109/MWSYM.2011.5972784",

language = "English",

isbn = "9781612847566",

series = "IEEE MTT-S International Microwave Symposium Digest",

booktitle = "2011 IEEE MTT-S International Microwave Symposium, IMS 2011",

note = "2011 IEEE MTT-S International Microwave Symposium, IMS 2011 ; Conference date: 05-06-2011 Through 10-06-2011",

}

Brun, C, Chong, YC, Tan, D, Teo Hang Tong, E, Bila, S, Verdeyme, S, Baillargeat, D & Tay, BK 2011, Study of carbon nanotube flip-chip methodology for interconnect technology via electromagnetic and circuit model approach. in 2011 IEEE MTT-S International Microwave Symposium, IMS 2011., 5972784, IEEE MTT-S International Microwave Symposium Digest, 2011 IEEE MTT-S International Microwave Symposium, IMS 2011, Baltimore, MD, United States, 6/5/11. https://doi.org/10.1109/MWSYM.2011.5972784

Study of carbon nanotube flip-chip methodology for interconnect technology via electromagnetic and circuit model approach. / Brun, Christophe; Chong, Yap Chin; Tan, Dunlin et al.
2011 IEEE MTT-S International Microwave Symposium, IMS 2011. 2011. 5972784 (IEEE MTT-S International Microwave Symposium Digest).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Study of carbon nanotube flip-chip methodology for interconnect technology via electromagnetic and circuit model approach

AU - Brun, Christophe

AU - Chong, Yap Chin

AU - Tan, Dunlin

AU - Teo Hang Tong, Edwin

AU - Bila, Stéphane

AU - Verdeyme, Serge

AU - Baillargeat, Dominique

AU - Tay, Beng Kang

PY - 2011

Y1 - 2011

N2 - Due to their excellent electronic and thermal properties, carbon nanotubes (CNTs) are considered as promising candidates for circuit interconnects. In this paper, we show for the first time both a theoretical and experimental analysis of CNT based flip-chip interconnects in the microwave domain. Two theoretical models of CNT were defined and compared exhibiting good agreement: one is based on electromagnetic simulations whereas the second one is based on circuit simulations. Finally, promising experimental studies were done in order to demonstrate the principle of the CNTs based flip-chip interconnect.

AB - Due to their excellent electronic and thermal properties, carbon nanotubes (CNTs) are considered as promising candidates for circuit interconnects. In this paper, we show for the first time both a theoretical and experimental analysis of CNT based flip-chip interconnects in the microwave domain. Two theoretical models of CNT were defined and compared exhibiting good agreement: one is based on electromagnetic simulations whereas the second one is based on circuit simulations. Finally, promising experimental studies were done in order to demonstrate the principle of the CNTs based flip-chip interconnect.

KW - Carbon nanotubes

KW - growth

KW - interconnection

KW - microwave

KW - modeling

UR - http://www.scopus.com/inward/record.url?scp=80052313907&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=80052313907&partnerID=8YFLogxK

U2 - 10.1109/MWSYM.2011.5972784

DO - 10.1109/MWSYM.2011.5972784

M3 - Conference contribution

AN - SCOPUS:80052313907

SN - 9781612847566

T3 - IEEE MTT-S International Microwave Symposium Digest

BT - 2011 IEEE MTT-S International Microwave Symposium, IMS 2011

T2 - 2011 IEEE MTT-S International Microwave Symposium, IMS 2011

Y2 - 5 June 2011 through 10 June 2011

ER -

Study of carbon nanotube flip-chip methodology for interconnect technology via electromagnetic and circuit model approach

Abstract

Publication series

Conference

ASJC Scopus Subject Areas

Keywords

Access to Document

Other files and links

Fingerprint

Cite this