Study of carbon nanotube flip-chip methodology for interconnect technology via electromagnetic and circuit model approach

Christophe Brun*, Yap Chin Chong, Dunlin Tan, Edwin Teo Hang Tong, Stéphane Bila, Serge Verdeyme, Dominique Baillargeat, Beng Kang Tay

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

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Keyphrases

Engineering

Material Science

Computer Science