Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

Riko I. Made; Chee Lip Gan; Li Ling Yan; Aibin Yu; Seung Wook Yoon; John H. Lau; Chengkuo Lee

doi:10.1007/s11664-008-0555-8

Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

Riko I. Made, Chee Lip Gan, Li Ling Yan, Aibin Yu, Seung Wook Yoon, John H. Lau, Chengkuo Lee

Research output: Contribution to journal › Article › peer-review

50 Citations (Scopus)

Abstract

Low-temperature solders have wide applications in integrated circuits and micro-electromechanical systems packaging. In this article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out. The resulting joint consists of AgIn ₂ and Ag ₉In ₄ phases, with the latter phase having a melting temperature higher than 400°C. Complete consumption of In solder into a Ag-rich intermetallic compound is achieved by applying a bond pressure of 1.4 MPa at 180°C for 40 min. We also observe that the bonding pressure effect enables a Ag-rich phase to be formed within a shorter bonding duration (10 min) at a higher pressure of 1.6 MPa. Finally, prolonged aging leads to the formation of the final phase of Ag ₉In ₄ in the bonded joints.

Original language	English
Pages (from-to)	365-371
Number of pages	7
Journal	Journal of Electronic Materials
Volume	38
Issue number	2
DOIs	https://doi.org/10.1007/s11664-008-0555-8
Publication status	Published - Feb 2009
Externally published	Yes

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Keywords

IC
Indium
Low-temperature solder
MEMS
Packaging

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10.1007/s11664-008-0555-8

Cite this

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title = "Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications",

abstract = "Low-temperature solders have wide applications in integrated circuits and micro-electromechanical systems packaging. In this article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out. The resulting joint consists of AgIn 2 and Ag 9In 4 phases, with the latter phase having a melting temperature higher than 400°C. Complete consumption of In solder into a Ag-rich intermetallic compound is achieved by applying a bond pressure of 1.4 MPa at 180°C for 40 min. We also observe that the bonding pressure effect enables a Ag-rich phase to be formed within a shorter bonding duration (10 min) at a higher pressure of 1.6 MPa. Finally, prolonged aging leads to the formation of the final phase of Ag 9In 4 in the bonded joints.",

keywords = "IC, Indium, Low-temperature solder, MEMS, Packaging",

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AU - Made, Riko I.

AU - Gan, Chee Lip

AU - Yan, Li Ling

AU - Yu, Aibin

AU - Yoon, Seung Wook

AU - Lau, John H.

AU - Lee, Chengkuo

PY - 2009/2

Y1 - 2009/2

N2 - Low-temperature solders have wide applications in integrated circuits and micro-electromechanical systems packaging. In this article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out. The resulting joint consists of AgIn 2 and Ag 9In 4 phases, with the latter phase having a melting temperature higher than 400°C. Complete consumption of In solder into a Ag-rich intermetallic compound is achieved by applying a bond pressure of 1.4 MPa at 180°C for 40 min. We also observe that the bonding pressure effect enables a Ag-rich phase to be formed within a shorter bonding duration (10 min) at a higher pressure of 1.6 MPa. Finally, prolonged aging leads to the formation of the final phase of Ag 9In 4 in the bonded joints.

AB - Low-temperature solders have wide applications in integrated circuits and micro-electromechanical systems packaging. In this article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out. The resulting joint consists of AgIn 2 and Ag 9In 4 phases, with the latter phase having a melting temperature higher than 400°C. Complete consumption of In solder into a Ag-rich intermetallic compound is achieved by applying a bond pressure of 1.4 MPa at 180°C for 40 min. We also observe that the bonding pressure effect enables a Ag-rich phase to be formed within a shorter bonding duration (10 min) at a higher pressure of 1.6 MPa. Finally, prolonged aging leads to the formation of the final phase of Ag 9In 4 in the bonded joints.

KW - IC

KW - Indium

KW - Low-temperature solder

KW - MEMS

KW - Packaging

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Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

Abstract

ASJC Scopus Subject Areas

Keywords

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