Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits

Riko I. Made*, Lan Peng Lan, Hong Yu Li, Chee Lip Gan, Chuan Seng Tan

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

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Physics

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Material Science

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