Study of TiN films by filtered cathodic vacuum arc techniques

Keyphrases

• Arc Technique 100%
• Atomic Force Microscopy 50%
• Compressive Stress 50%
• Deposited Film 50%
• Filtered Cathodic Vacuum Arc 100%
• Grain Size 50%
• In Films 50%
• Mechanical Behavior 50%
• Negative Substrate Bias 100%
• Si Wafer 50%
• Structural Behavior 50%
• Surface Grain 50%
• Surface Roughness 50%
• TiN Film 100%
• X Ray Diffraction 50%

Engineering

• Atomic Force Microscopy 50%
• Compressive Stress 50%
• Deposited Film 50%
• Mechanical Property 50%
• Ray Diffraction 50%
• Si Wafer 50%
• Substrate Bias 100%