Study on thermal boundary conductance between diamond and amorphous carbon

Narjes Khosravian; Majid Kabiri Samani; Guan Chee Loh; Maziar Shakerzadeh; Dominique Baillargeat; Beng Kang Tay

doi:10.1109/EPTC.2011.6184530

Study on thermal boundary conductance between diamond and amorphous carbon

Narjes Khosravian^*, Majid Kabiri Samani, Guan Chee Loh, Maziar Shakerzadeh, Dominique Baillargeat, Beng Kang Tay

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Thermal boundary conductance at the interface of diamond-amorphous carbon has been calculated using non-equilibrium molecular dynamic simulation. In particular, we describe the effect of solid stiffness, which associated with sp ³ hybridization ratio of amorphous carbon, on thermal boundary conductance. The result shows that by increasing the sp ³ hybridization ratio of amorphous carbon, thermal boundary conductance between diamond and amorphous carbon increases.

Original language	English
Title of host publication	2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
Pages	839-840
Number of pages	2
DOIs	https://doi.org/10.1109/EPTC.2011.6184530
Publication status	Published - 2011
Externally published	Yes
Event	2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 - Singapore, Singapore Duration: Dec 7 2011 → Dec 9 2011

Publication series

Name	2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Conference

Conference	2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
Country/Territory	Singapore
City	Singapore
Period	12/7/11 → 12/9/11

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Access to Document

10.1109/EPTC.2011.6184530

Cite this

Khosravian, N., Samani, M. K., Loh, G. C., Shakerzadeh, M., Baillargeat, D., & Tay, B. K. (2011). Study on thermal boundary conductance between diamond and amorphous carbon. In 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 (pp. 839-840). Article 6184530 (2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011). https://doi.org/10.1109/EPTC.2011.6184530

@inproceedings{370b8c3b7bd345fbbf546c3c53ab3ca2,

title = "Study on thermal boundary conductance between diamond and amorphous carbon",

abstract = "Thermal boundary conductance at the interface of diamond-amorphous carbon has been calculated using non-equilibrium molecular dynamic simulation. In particular, we describe the effect of solid stiffness, which associated with sp 3 hybridization ratio of amorphous carbon, on thermal boundary conductance. The result shows that by increasing the sp 3 hybridization ratio of amorphous carbon, thermal boundary conductance between diamond and amorphous carbon increases.",

author = "Narjes Khosravian and Samani, {Majid Kabiri} and Loh, {Guan Chee} and Maziar Shakerzadeh and Dominique Baillargeat and Tay, {Beng Kang}",

year = "2011",

doi = "10.1109/EPTC.2011.6184530",

language = "English",

isbn = "9781457719837",

series = "2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011",

pages = "839--840",

booktitle = "2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011",

note = "2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 ; Conference date: 07-12-2011 Through 09-12-2011",

}

Khosravian, N, Samani, MK, Loh, GC, Shakerzadeh, M, Baillargeat, D & Tay, BK 2011, Study on thermal boundary conductance between diamond and amorphous carbon. in 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011., 6184530, 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011, pp. 839-840, 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011, Singapore, Singapore, 12/7/11. https://doi.org/10.1109/EPTC.2011.6184530

Study on thermal boundary conductance between diamond and amorphous carbon. / Khosravian, Narjes; Samani, Majid Kabiri; Loh, Guan Chee et al.
2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011. 2011. p. 839-840 6184530 (2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Study on thermal boundary conductance between diamond and amorphous carbon

AU - Khosravian, Narjes

AU - Samani, Majid Kabiri

AU - Loh, Guan Chee

AU - Shakerzadeh, Maziar

AU - Baillargeat, Dominique

AU - Tay, Beng Kang

PY - 2011

Y1 - 2011

N2 - Thermal boundary conductance at the interface of diamond-amorphous carbon has been calculated using non-equilibrium molecular dynamic simulation. In particular, we describe the effect of solid stiffness, which associated with sp 3 hybridization ratio of amorphous carbon, on thermal boundary conductance. The result shows that by increasing the sp 3 hybridization ratio of amorphous carbon, thermal boundary conductance between diamond and amorphous carbon increases.

AB - Thermal boundary conductance at the interface of diamond-amorphous carbon has been calculated using non-equilibrium molecular dynamic simulation. In particular, we describe the effect of solid stiffness, which associated with sp 3 hybridization ratio of amorphous carbon, on thermal boundary conductance. The result shows that by increasing the sp 3 hybridization ratio of amorphous carbon, thermal boundary conductance between diamond and amorphous carbon increases.

UR - http://www.scopus.com/inward/record.url?scp=84860913490&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84860913490&partnerID=8YFLogxK

U2 - 10.1109/EPTC.2011.6184530

DO - 10.1109/EPTC.2011.6184530

M3 - Conference contribution

AN - SCOPUS:84860913490

SN - 9781457719837

T3 - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

SP - 839

EP - 840

BT - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

T2 - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Y2 - 7 December 2011 through 9 December 2011

ER -

Study on thermal boundary conductance between diamond and amorphous carbon

Abstract

Publication series

Conference

ASJC Scopus Subject Areas

Access to Document

Other files and links

Fingerprint

Cite this