Abstract
The current device for miniaturization and higher device counts in IC (integrated circuit) packages has significantly increased the use of both multilayer ceramic packages (MLCP) and multilayer capacitors (MLC). Both employ thin ceramic tapes with very high dielectric properties which are cast using solid powders. Crucial to the production of these ceramic substrates using hollow micro-spherical powders via the tape casting method. This involved the proper control of both the formulation as well as processing parameters, both of which were critical to the quality and reproducibility of the substrates.
| Original language | English |
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| Pages | 451-461 |
| Number of pages | 11 |
| Publication status | Published - 1998 |
| Externally published | Yes |
| Event | Proceedings of the 1998 TMS Fall Meeting - Rosemont, IL, USA Duration: Oct 11 1998 → Oct 15 1998 |
Conference
| Conference | Proceedings of the 1998 TMS Fall Meeting |
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| City | Rosemont, IL, USA |
| Period | 10/11/98 → 10/15/98 |
ASJC Scopus Subject Areas
- General Engineering