Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages

H. B. Kor; A. C.K. Chang; C. L. Gan

doi:10.1109/IPFA.2010.5531987

Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages

H. B. Kor, A. C.K. Chang, C. L. Gan

Nanyang Technological University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

Ablation was carried out on high voltage Schottky rectifiers at 25°C and -5°C (with a thermoelectric cooler or TEC), at 1.0 W and 3.9 W of laser power. In-situ measurement of the reverse current was conducted and correlated to the device junction temperature. It was found that the usage of a TEC increases the number of laser scans to reach the set current compliance of 100 μA after exposing the die, for ablation at 3.9 W, although eventual damage to the device is still unavoidable. The incorporation of a TEC below the sample is also demonstrated to be effective in reducing the device junction temperature during laser ablation.

Original language	English
Title of host publication	IPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits
DOIs	https://doi.org/10.1109/IPFA.2010.5531987
Publication status	Published - 2010
Externally published	Yes
Event	17th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2010 - Singapore, Singapore Duration: Jul 5 2010 → Jul 9 2010

Publication series

Name	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Conference

Conference	17th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2010
Country/Territory	Singapore
City	Singapore
Period	7/5/10 → 7/9/10

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Access to Document

10.1109/IPFA.2010.5531987

Cite this

Kor, H. B., Chang, A. C. K., & Gan, C. L. (2010). Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages. In IPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits Article 5531987 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). https://doi.org/10.1109/IPFA.2010.5531987

@inproceedings{875e4bcab49043fbba9f0bbf717a31fa,

title = "Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages",

abstract = "Ablation was carried out on high voltage Schottky rectifiers at 25°C and -5°C (with a thermoelectric cooler or TEC), at 1.0 W and 3.9 W of laser power. In-situ measurement of the reverse current was conducted and correlated to the device junction temperature. It was found that the usage of a TEC increases the number of laser scans to reach the set current compliance of 100 μA after exposing the die, for ablation at 3.9 W, although eventual damage to the device is still unavoidable. The incorporation of a TEC below the sample is also demonstrated to be effective in reducing the device junction temperature during laser ablation.",

author = "Kor, \{H. B.\} and Chang, \{A. C.K.\} and Gan, \{C. L.\}",

year = "2010",

doi = "10.1109/IPFA.2010.5531987",

language = "English",

isbn = "9781424455973",

series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",

booktitle = "IPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits",

note = "17th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2010 ; Conference date: 05-07-2010 Through 09-07-2010",

}

Kor, HB, Chang, ACK & Gan, CL 2010, Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages. in IPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits., 5531987, Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2010, Singapore, Singapore, 7/5/10. https://doi.org/10.1109/IPFA.2010.5531987

Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages. / Kor, H. B.; Chang, A. C.K.; Gan, C. L.
IPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits. 2010. 5531987 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages

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AU - Chang, A. C.K.

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N2 - Ablation was carried out on high voltage Schottky rectifiers at 25°C and -5°C (with a thermoelectric cooler or TEC), at 1.0 W and 3.9 W of laser power. In-situ measurement of the reverse current was conducted and correlated to the device junction temperature. It was found that the usage of a TEC increases the number of laser scans to reach the set current compliance of 100 μA after exposing the die, for ablation at 3.9 W, although eventual damage to the device is still unavoidable. The incorporation of a TEC below the sample is also demonstrated to be effective in reducing the device junction temperature during laser ablation.

AB - Ablation was carried out on high voltage Schottky rectifiers at 25°C and -5°C (with a thermoelectric cooler or TEC), at 1.0 W and 3.9 W of laser power. In-situ measurement of the reverse current was conducted and correlated to the device junction temperature. It was found that the usage of a TEC increases the number of laser scans to reach the set current compliance of 100 μA after exposing the die, for ablation at 3.9 W, although eventual damage to the device is still unavoidable. The incorporation of a TEC below the sample is also demonstrated to be effective in reducing the device junction temperature during laser ablation.

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T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

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Kor HB, Chang ACK, Gan CL. Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages. In IPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits. 2010. 5531987. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). doi: 10.1109/IPFA.2010.5531987

Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages

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