Fingerprint
Dive into the research topics of 'The combined impact of voids and thermal aging on the mechanical reliability of epoxy resin evaluated by statistical analysis'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
The combined impact of voids and thermal aging on the mechanical reliability of epoxy resin evaluated by statistical analysis
Yuheng Deng, Qi Wang, Jielin Ma, Joo Tien Oh, Zhong Chen*
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
13
Citations
(Scopus)