The effects of Ca and Pd dopants on gold bonding wire and gold rod

T. S. Saraswati; T. Sritharan; C. I. Pang; Y. H. Chew; C. D. Breach; F. Wulff; S. G. Mhaisalkar; C. C. Wong

doi:10.1016/j.tsf.2004.05.032

The effects of Ca and Pd dopants on gold bonding wire and gold rod

T. S. Saraswati^*, T. Sritharan, C. I. Pang, Y. H. Chew, C. D. Breach, F. Wulff, S. G. Mhaisalkar, C. C. Wong

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

18 Citations (Scopus)

Abstract

There is currently little information regarding the physiochemical effects of common bonding wire dopants such as Ca and Pd despite the use of gold bonding wire as an electrical interconnection in over 80% of semiconductor devices. This paper presents experimental results on the residual microstrains in 4 N gold bonding wires with different concentrations of Ca-Pd, measured using peak broadening in X-ray diffraction. The effect of Ca was found to be more prominent. In order to understand more about the physiochemical action of Ca and its effects on the microstructure, TEM and depth sensing nano-indentation (DSI) were used to study 2 mm Ca-doped hard-drawn rods.

Original language	English
Pages (from-to)	351-356
Number of pages	6
Journal	Thin Solid Films
Volume	462-463
Issue number	SPEC. ISS.
DOIs	https://doi.org/10.1016/j.tsf.2004.05.032
Publication status	Published - Sept 2004
Externally published	Yes

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Surfaces and Interfaces
Surfaces, Coatings and Films
Metals and Alloys
Materials Chemistry

Keywords

Depth sensing indentation
Gold bonding wire
TEM
X-ray stress analysis

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10.1016/j.tsf.2004.05.032

Cite this

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title = "The effects of Ca and Pd dopants on gold bonding wire and gold rod",

abstract = "There is currently little information regarding the physiochemical effects of common bonding wire dopants such as Ca and Pd despite the use of gold bonding wire as an electrical interconnection in over 80% of semiconductor devices. This paper presents experimental results on the residual microstrains in 4 N gold bonding wires with different concentrations of Ca-Pd, measured using peak broadening in X-ray diffraction. The effect of Ca was found to be more prominent. In order to understand more about the physiochemical action of Ca and its effects on the microstructure, TEM and depth sensing nano-indentation (DSI) were used to study 2 mm Ca-doped hard-drawn rods.",

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T1 - The effects of Ca and Pd dopants on gold bonding wire and gold rod

AU - Saraswati, T. S.

AU - Sritharan, T.

AU - Pang, C. I.

AU - Chew, Y. H.

AU - Breach, C. D.

AU - Wulff, F.

AU - Mhaisalkar, S. G.

AU - Wong, C. C.

PY - 2004/9

Y1 - 2004/9

N2 - There is currently little information regarding the physiochemical effects of common bonding wire dopants such as Ca and Pd despite the use of gold bonding wire as an electrical interconnection in over 80% of semiconductor devices. This paper presents experimental results on the residual microstrains in 4 N gold bonding wires with different concentrations of Ca-Pd, measured using peak broadening in X-ray diffraction. The effect of Ca was found to be more prominent. In order to understand more about the physiochemical action of Ca and its effects on the microstructure, TEM and depth sensing nano-indentation (DSI) were used to study 2 mm Ca-doped hard-drawn rods.

AB - There is currently little information regarding the physiochemical effects of common bonding wire dopants such as Ca and Pd despite the use of gold bonding wire as an electrical interconnection in over 80% of semiconductor devices. This paper presents experimental results on the residual microstrains in 4 N gold bonding wires with different concentrations of Ca-Pd, measured using peak broadening in X-ray diffraction. The effect of Ca was found to be more prominent. In order to understand more about the physiochemical action of Ca and its effects on the microstructure, TEM and depth sensing nano-indentation (DSI) were used to study 2 mm Ca-doped hard-drawn rods.

KW - Depth sensing indentation

KW - Gold bonding wire

KW - TEM

KW - X-ray stress analysis

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JO - Thin Solid Films

JF - Thin Solid Films

IS - SPEC. ISS.

ER -

The effects of Ca and Pd dopants on gold bonding wire and gold rod

Abstract

ASJC Scopus Subject Areas

Keywords

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