The overview of the impacts of electron radiation on semiconductor failure analysis by SEM, FIB and TEM

Binghai Liu; Younan Hua; Zhili Dong; Pik Kee Tan; Yuzhe Zhao; Zhiqiang Mo; Jeffrey Lam; Zhihong Mai

doi:10.1109/IPFA.2018.8452485

The overview of the impacts of electron radiation on semiconductor failure analysis by SEM, FIB and TEM

Binghai Liu, Younan Hua, Zhili Dong, Pik Kee Tan, Yuzhe Zhao, Zhiqiang Mo, Jeffrey Lam, Zhihong Mai

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

The paper briefly overviewed electron-beam radiation damage and its impacts on physical failure analysis by SEM, FIB and TEM. Based on our electron radiation study on some typical electron-beam sensitive materials, we discussed some interesting results associated with electron radiation damage to Lk/ULK, silicon nitride and CoFeB thin film materials in semiconductor and MRAM devices. The details included radiation induced microstructure changes., material diffusion and phase transformation. The underlying mechanism was also briefly discussed for electron radiation damage to different materials.

Original language	English
Title of host publication	IPFA 2018 - 25th International Symposium on the Physical and Failure Analysis of Integrated Circuits
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Print)	9781538649299
DOIs	https://doi.org/10.1109/IPFA.2018.8452485
Publication status	Published - Aug 30 2018
Externally published	Yes
Event	25th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2018 - Singapore, Singapore Duration: Jul 16 2018 → Jul 19 2018

Publication series

Name	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Volume	2018-July

Conference

Conference	25th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2018
Country/Territory	Singapore
City	Singapore
Period	7/16/18 → 7/19/18

Bibliographical note

Publisher Copyright:
© 2018 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Keywords

electron beam radiation
electron beam sensitive
failure analysis
FIB
radiation damage
SEM
TEM

Access to Document

10.1109/IPFA.2018.8452485

Cite this

Liu, B., Hua, Y., Dong, Z., Tan, P. K., Zhao, Y., Mo, Z., Lam, J., & Mai, Z. (2018). The overview of the impacts of electron radiation on semiconductor failure analysis by SEM, FIB and TEM. In IPFA 2018 - 25th International Symposium on the Physical and Failure Analysis of Integrated Circuits Article 8452485 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; Vol. 2018-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPFA.2018.8452485

Liu, Binghai ; Hua, Younan ; Dong, Zhili et al. / The overview of the impacts of electron radiation on semiconductor failure analysis by SEM, FIB and TEM. IPFA 2018 - 25th International Symposium on the Physical and Failure Analysis of Integrated Circuits. Institute of Electrical and Electronics Engineers Inc., 2018. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

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title = "The overview of the impacts of electron radiation on semiconductor failure analysis by SEM, FIB and TEM",

abstract = "The paper briefly overviewed electron-beam radiation damage and its impacts on physical failure analysis by SEM, FIB and TEM. Based on our electron radiation study on some typical electron-beam sensitive materials, we discussed some interesting results associated with electron radiation damage to Lk/ULK, silicon nitride and CoFeB thin film materials in semiconductor and MRAM devices. The details included radiation induced microstructure changes., material diffusion and phase transformation. The underlying mechanism was also briefly discussed for electron radiation damage to different materials.",

keywords = "electron beam radiation, electron beam sensitive, failure analysis, FIB, radiation damage, SEM, TEM",

author = "Binghai Liu and Younan Hua and Zhili Dong and Tan, {Pik Kee} and Yuzhe Zhao and Zhiqiang Mo and Jeffrey Lam and Zhihong Mai",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 25th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2018 ; Conference date: 16-07-2018 Through 19-07-2018",

year = "2018",

month = aug,

day = "30",

doi = "10.1109/IPFA.2018.8452485",

language = "English",

isbn = "9781538649299",

series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",

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Liu, B, Hua, Y, Dong, Z, Tan, PK, Zhao, Y, Mo, Z, Lam, J & Mai, Z 2018, The overview of the impacts of electron radiation on semiconductor failure analysis by SEM, FIB and TEM. in IPFA 2018 - 25th International Symposium on the Physical and Failure Analysis of Integrated Circuits., 8452485, Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, vol. 2018-July, Institute of Electrical and Electronics Engineers Inc., 25th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2018, Singapore, Singapore, 7/16/18. https://doi.org/10.1109/IPFA.2018.8452485

The overview of the impacts of electron radiation on semiconductor failure analysis by SEM, FIB and TEM. / Liu, Binghai; Hua, Younan; Dong, Zhili et al.
IPFA 2018 - 25th International Symposium on the Physical and Failure Analysis of Integrated Circuits. Institute of Electrical and Electronics Engineers Inc., 2018. 8452485 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; Vol. 2018-July).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - The overview of the impacts of electron radiation on semiconductor failure analysis by SEM, FIB and TEM

AU - Liu, Binghai

AU - Hua, Younan

AU - Dong, Zhili

AU - Tan, Pik Kee

AU - Zhao, Yuzhe

AU - Mo, Zhiqiang

AU - Lam, Jeffrey

AU - Mai, Zhihong

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N2 - The paper briefly overviewed electron-beam radiation damage and its impacts on physical failure analysis by SEM, FIB and TEM. Based on our electron radiation study on some typical electron-beam sensitive materials, we discussed some interesting results associated with electron radiation damage to Lk/ULK, silicon nitride and CoFeB thin film materials in semiconductor and MRAM devices. The details included radiation induced microstructure changes., material diffusion and phase transformation. The underlying mechanism was also briefly discussed for electron radiation damage to different materials.

AB - The paper briefly overviewed electron-beam radiation damage and its impacts on physical failure analysis by SEM, FIB and TEM. Based on our electron radiation study on some typical electron-beam sensitive materials, we discussed some interesting results associated with electron radiation damage to Lk/ULK, silicon nitride and CoFeB thin film materials in semiconductor and MRAM devices. The details included radiation induced microstructure changes., material diffusion and phase transformation. The underlying mechanism was also briefly discussed for electron radiation damage to different materials.

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KW - electron beam sensitive

KW - failure analysis

KW - FIB

KW - radiation damage

KW - SEM

KW - TEM

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T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

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Liu B, Hua Y, Dong Z, Tan PK, Zhao Y, Mo Z et al. The overview of the impacts of electron radiation on semiconductor failure analysis by SEM, FIB and TEM. In IPFA 2018 - 25th International Symposium on the Physical and Failure Analysis of Integrated Circuits. Institute of Electrical and Electronics Engineers Inc. 2018. 8452485. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). doi: 10.1109/IPFA.2018.8452485

The overview of the impacts of electron radiation on semiconductor failure analysis by SEM, FIB and TEM

Abstract

Publication series

Conference

Bibliographical note

ASJC Scopus Subject Areas

Keywords

Access to Document

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Cite this