Thermal conductivity of polystyrene-aluminum nitride composite

Suzhu Yu*, Peter Hing, Xiao Hu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

297 Citations (Scopus)

Abstract

The thermal conductivity of polymer composites having a matrix of polystyrene (PS) containing aluminum nitride (AlN) reinforcement has been investigated under a special dispersion state of filler in the composites: aluminum nitride filler particles surrounding polystyrene matrix particles. Data for the thermal conductivity of the composites are discussed as a function of composition parameters (aluminum nitride concentration, polystyrene particle size) and temperature. It is found that the thermal conductivity of composites is higher for a polystyrene particle size of 2 mm than that for a particle size of 0.15 mm. The thermal conductivity of the composite is five times that of pure polystyrene at about 20% volume fraction of AlN for the composite containing 2 mm polystyrene particle size. The relationship between thermal conductivity of composites and AlN filler concentrations has been compared with the predictions of two theoretical models from the literature.

Original languageEnglish
Pages (from-to)289-292
Number of pages4
JournalComposites - Part A: Applied Science and Manufacturing
Volume33
Issue number2
DOIs
Publication statusPublished - Feb 2002
Externally publishedYes

ASJC Scopus Subject Areas

  • Ceramics and Composites
  • Mechanics of Materials

Keywords

  • Microelectronic packaging materials

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