Abstract
The thermal conductivity of polymer composites having a matrix of polystyrene (PS) containing aluminum nitride (AlN) reinforcement has been investigated under a special dispersion state of filler in the composites: aluminum nitride filler particles surrounding polystyrene matrix particles. Data for the thermal conductivity of the composites are discussed as a function of composition parameters (aluminum nitride concentration, polystyrene particle size) and temperature. It is found that the thermal conductivity of composites is higher for a polystyrene particle size of 2 mm than that for a particle size of 0.15 mm. The thermal conductivity of the composite is five times that of pure polystyrene at about 20% volume fraction of AlN for the composite containing 2 mm polystyrene particle size. The relationship between thermal conductivity of composites and AlN filler concentrations has been compared with the predictions of two theoretical models from the literature.
Original language | English |
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Pages (from-to) | 289-292 |
Number of pages | 4 |
Journal | Composites - Part A: Applied Science and Manufacturing |
Volume | 33 |
Issue number | 2 |
DOIs | |
Publication status | Published - Feb 2002 |
Externally published | Yes |
ASJC Scopus Subject Areas
- Ceramics and Composites
- Mechanics of Materials
Keywords
- Microelectronic packaging materials