Thermal graft copolymerization of 4-vinyl pyridine on polyimide to improve adhesion to copper

M. B. Chan-Park; S. S. Tan

doi:10.1016/S0143-7496(02)00057-X

Thermal graft copolymerization of 4-vinyl pyridine on polyimide to improve adhesion to copper

M. B. Chan-Park^*, S. S. Tan

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

25 Citations (Scopus)

Abstract

The surface of poly[N,N′-(oxydiphenylene)pyromellitimide] film, Kapton® HN, was modified to improve its adhesion to copper metal. The polyimide surface was argon plasma activated and then exposed to air. A nitrogen-containing monomer, 4-vinyl pyridine, was then polymerized at elevated temperature under constant pressure between the argon plasma activated polyimide film and copper foil without any added photoinitiator. Optimization of the argon pretreatment time, curing temperature and curing duration resulted in almost doubling of the single lap shear strength. It is postulated that failure occurred mainly between the polyimide and the poly(4-vinyl pyridine).

Original language	English
Pages (from-to)	471-475
Number of pages	5
Journal	International Journal of Adhesion and Adhesives
Volume	22
Issue number	6
DOIs	https://doi.org/10.1016/S0143-7496(02)00057-X
Publication status	Published - 2002
Externally published	Yes

ASJC Scopus Subject Areas

Biomaterials
General Chemical Engineering
Polymers and Plastics

Keywords

Adhesion
B. Plasma
Graft
Polyimide

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10.1016/S0143-7496(02)00057-X

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title = "Thermal graft copolymerization of 4-vinyl pyridine on polyimide to improve adhesion to copper",

abstract = "The surface of poly[N,N′-(oxydiphenylene)pyromellitimide] film, Kapton{\textregistered} HN, was modified to improve its adhesion to copper metal. The polyimide surface was argon plasma activated and then exposed to air. A nitrogen-containing monomer, 4-vinyl pyridine, was then polymerized at elevated temperature under constant pressure between the argon plasma activated polyimide film and copper foil without any added photoinitiator. Optimization of the argon pretreatment time, curing temperature and curing duration resulted in almost doubling of the single lap shear strength. It is postulated that failure occurred mainly between the polyimide and the poly(4-vinyl pyridine).",

keywords = "Adhesion, B. Plasma, Graft, Polyimide",

author = "Chan-Park, {M. B.} and Tan, {S. S.}",

year = "2002",

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language = "English",

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T1 - Thermal graft copolymerization of 4-vinyl pyridine on polyimide to improve adhesion to copper

AU - Chan-Park, M. B.

AU - Tan, S. S.

PY - 2002

Y1 - 2002

N2 - The surface of poly[N,N′-(oxydiphenylene)pyromellitimide] film, Kapton® HN, was modified to improve its adhesion to copper metal. The polyimide surface was argon plasma activated and then exposed to air. A nitrogen-containing monomer, 4-vinyl pyridine, was then polymerized at elevated temperature under constant pressure between the argon plasma activated polyimide film and copper foil without any added photoinitiator. Optimization of the argon pretreatment time, curing temperature and curing duration resulted in almost doubling of the single lap shear strength. It is postulated that failure occurred mainly between the polyimide and the poly(4-vinyl pyridine).

AB - The surface of poly[N,N′-(oxydiphenylene)pyromellitimide] film, Kapton® HN, was modified to improve its adhesion to copper metal. The polyimide surface was argon plasma activated and then exposed to air. A nitrogen-containing monomer, 4-vinyl pyridine, was then polymerized at elevated temperature under constant pressure between the argon plasma activated polyimide film and copper foil without any added photoinitiator. Optimization of the argon pretreatment time, curing temperature and curing duration resulted in almost doubling of the single lap shear strength. It is postulated that failure occurred mainly between the polyimide and the poly(4-vinyl pyridine).

KW - Adhesion

KW - B. Plasma

KW - Graft

KW - Polyimide

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U2 - 10.1016/S0143-7496(02)00057-X

DO - 10.1016/S0143-7496(02)00057-X

M3 - Article

AN - SCOPUS:0036448821

SN - 0143-7496

VL - 22

SP - 471

EP - 475

JO - International Journal of Adhesion and Adhesives

JF - International Journal of Adhesion and Adhesives

IS - 6

ER -

Thermal graft copolymerization of 4-vinyl pyridine on polyimide to improve adhesion to copper

Abstract

ASJC Scopus Subject Areas

Keywords

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