Top down scale-up of semiconducting nanostructures for large area electronics

Cheng Sun, Arman Ahnood, Sungsik Lee, Nripan Mathews, Subodh Mhaisalkar, Arokia Nathan

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

In this paper, we present a study on electrical and optical characteristics of n-type tin-oxide nanowires integrated based on top-down scale-up strategy. Through a combination of contact printing and plasma based back-channel passivation, we have achieved stable electrical characteristics with standard deviation in mobility and threshold voltage of 9.1% and 25%, respectively, for a large area of 1× 1 cm2 area. Through use of contact printing, high alignment of nanowires was achieved thus minimizing the number of nanowire-nanowire junctions, which serve to limit carrier transport in the channel. In addition, persistent photoconductivity has been observed, which we attribute to oxygen vacancy ionization and subsequent elimination using a gate pulse driving scheme.

Original languageEnglish
Article number6776429
Pages (from-to)660-665
Number of pages6
JournalIEEE/OSA Journal of Display Technology
Volume10
Issue number8
DOIs
Publication statusPublished - Aug 2014
Externally publishedYes

ASJC Scopus Subject Areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Keywords

  • Large area electronics
  • Nanowires
  • Plasma- enhanced chemical vapor deposition
  • Top-down integration
  • Uniformity

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