Abstract
A lead-free Ag-based soldering technique through transient-liquid-phase (TLP) bonding is proposed in this study for high-temperature microelectronic packaging applications. The solder paste, which contained Ag and Sn powders with a no-clean flux, was used to join Cu substrates. The setup was bonded at 250 C for 10 minutes. The study focuses on mechanical and microstructural characterizations of the joints. The shear strength measured at 250 C shows good high temperature performance of the joint. The effects of Ag and Sn contents on mechanical, electrical and thermal properties of sintered bulk Ag-Sn samples were also investigated independently. The results demonstrate that the Ag-Sn TLP bonding is an effective interconnection method for harsh environment electronic packaging.
| Original language | English |
|---|---|
| Pages (from-to) | 365-368 |
| Number of pages | 4 |
| Journal | Journal of Alloys and Compounds |
| Volume | 587 |
| DOIs | |
| Publication status | Published - 2014 |
| Externally published | Yes |
ASJC Scopus Subject Areas
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys
- Materials Chemistry
Keywords
- Harsh environment
- High-temperature reliability
- Intermetallic compounds
- Microelectronics packaging
- Transient-liquid-phase