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Transient liquid phase (TLP) bonding using Sn/Ag multilayers for high temperature applications
Nadeesh Singh Nobeen, Riko Imade, Byung Roon Lee, Eric Jian Rong Phua, Chee Cheong Wong, Chee Lip Gan, Zhong Chen
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
6
Citations
(Scopus)