TY - GEN
T1 - Understanding the electrical transport properties of carbon nanotubes and its metal under-layers
AU - Tan, D. L.
AU - Yap, C. C.
AU - Li, X. C.
AU - Wei, J.
AU - Baillargeat, D.
AU - Tay, B. K.
PY - 2011
Y1 - 2011
N2 - Carbon nanotubes have been widely studied due to its excellent electrical, thermal and mechanical properties, showing promising applications in both active and passive components in electronic devices. However, for such devices to be developed, compatibility issues for obtaining quality carbon nanotubes with suitable underlying substrates have to be understood. In this work, a technique to study the impact of each under layer on carbon nanotubes would be discussed. Vertically aligned multiwalled carbon nanotubes are grown on patterned metal trace with suitable barrier layers. In situ electrical measurement of the nanotubes using manipulators in a field emission scanning electron microscope was performed to understand the electrical transport at each interface.
AB - Carbon nanotubes have been widely studied due to its excellent electrical, thermal and mechanical properties, showing promising applications in both active and passive components in electronic devices. However, for such devices to be developed, compatibility issues for obtaining quality carbon nanotubes with suitable underlying substrates have to be understood. In this work, a technique to study the impact of each under layer on carbon nanotubes would be discussed. Vertically aligned multiwalled carbon nanotubes are grown on patterned metal trace with suitable barrier layers. In situ electrical measurement of the nanotubes using manipulators in a field emission scanning electron microscope was performed to understand the electrical transport at each interface.
UR - http://www.scopus.com/inward/record.url?scp=84860909917&partnerID=8YFLogxK
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U2 - 10.1109/EPTC.2011.6184395
DO - 10.1109/EPTC.2011.6184395
M3 - Conference contribution
AN - SCOPUS:84860909917
SN - 9781457719837
T3 - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
SP - 104
EP - 107
BT - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
T2 - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
Y2 - 7 December 2011 through 9 December 2011
ER -