Void formation in titanium desilicide/p+ silicon interface: Impact on junction leakage and silicide sheet resistance

K. L. Pey*, R. Sundaresan, H. Wong, S. Y. Siah, C. H. Tung

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

3 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Void formation in titanium desilicide/p+ silicon interface: Impact on junction leakage and silicide sheet resistance'. Together they form a unique fingerprint.

Material Science

Keyphrases

Engineering