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A micromechanism study of thermosonic gold wire bonding on aluminum pad
H. Xu*, C. Liu, V. V. Silberschmidt, S. S. Pramana, T. J. White, Z. Chen, M. Sivakumar, V. L. Acoff
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
65
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(Scopus)