Fingerprint
Dive into the research topics of 'Electromigration of lower and upper Cu lines in dual-damascene Cu interconnects'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Electromigration of lower and upper Cu lines in dual-damascene Cu interconnects
Ahila Krishnamoorthy*, Guo Qiang, Anand V. Vairagar, Subodh Mhaisalkar
*Corresponding author for this work
Research output: Contribution to journal › Conference article › peer-review
4
Citations
(Scopus)