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Fatal void size comparisons in via-below and via-above Cu dual-damascene interconnects
Z. S. Choi*, C. L. Gan, F. Wei, C. V. Thompson, J. H. Lee, K. L. Pey, W. K. Choi
*Corresponding author for this work
Research output: Contribution to journal › Conference article › peer-review
9
Citations
(Scopus)