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New mechanisms of void growth in Au-Al wire bonds: Volumetric shrinkage and intermetallic oxidation
H. Xu*, C. Liu, V. V. Silberschmidt, S. S. Pramana, T. J. White, Z. Chenc, V. L. Acoffa
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
35
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(Scopus)