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Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment
Y. S. Tay, L. Yang, H. Zhang, H. B. Kor, L. Zhang, H. Liu, V. Gill, A. Lambourne, K. H.H. Li, Z. Chen, C. L. Gan*
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
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(Scopus)