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Gan Chee Lip

Prof

 https://orcid.org/0000-0002-8420-3168
Calculated based on number of publications stored in Pure and citations from Scopus
Calculated based on number of publications stored in Pure and citations from Scopus
Calculated based on number of publications stored in Pure and citations from Scopus
1999 …2025

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  • 2012

    Study of thin film metallization adhesion in ceramic multichip module

    Dy, L. J., Rong, E. P. J., Riko, I. M., Sharif, A., Zhang, L. J., Long, L. F., Lip, G. C., Zhong, C., Minwoo, D. R. & Cheong, W. C., 2012, Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012. p. 67-71 5 p. 6507053. (Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    5 Citations (Scopus)
  • 2011

    3D current path in stacked devices: Metrics and challenges

    Kor, H. B., Infante, F., Perdu, P., Gan, C. L. & Lewis, D., 2011, 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011. Institute of Electrical and Electronics Engineers Inc., 5992789. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    Open Access
    4 Citations (Scopus)

  • Effects of side reservoirs on the electromigration lifetime of copper interconnects

    Mario, H., Gan, C. L., Lim, Y. K., Tan, J. B., Wei, J., Chookajorn, T. & Thompson, C. V., 2011, 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011. 5992779. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    5 Citations (Scopus)

  • Mechanical property characterization of Cu-Sn-In intermetallic thin films using microcantilevers

    Sasangka, W. A., Gan, C. L. & Thompson, C. V., 2011, 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011. 5992788. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • Non-destructive mechanical characterization of metal to metal bond interface for 3D-ICs

    Made, R. I. & Gan, C. L., 2011, 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2011. 5992797. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV)

    Che, F. X., Putra, W. N., Heryanto, A., Trigg, A., Gao, S. & Gan, C. L., 2011, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011. 6262985. (2011 IEEE International 3D Systems Integration Conference, 3DIC 2011).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    13 Citations (Scopus)

  • Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits

    Made, R. I., Peng Lan, L., Li, H. Y., Gan, C. L. & Tan, C. S., 2011, 2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, IITC/MAM 2011. 5940302. (2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, IITC/MAM 2011).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    Open Access
    4 Citations (Scopus)
  • 2010

    Low temperature bonding via copper nanowires for 3D integrated circuits

    Chun, S. R., Sasangka, W. A., Gan, C. L., Cai, H. & Ng, C. M., 2010, Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics. Materials Research Society, p. 223-228 6 p. (Materials Research Society Symposium Proceedings; vol. 1249).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • Modeling of electromigration induced contact resistance reduction of Cu-Cu bonded interface

    Made, R. I., Gan, C. L. & Tan, C. S., 2010, Processing, Materials, and Integration of Damascene and 3D Interconnects. 12 ed. Electrochemical Society Inc., p. 23-34 12 p. (ECS Transactions; vol. 33, no. 12).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    Open Access
    1 Citation (Scopus)

  • Property study of TbFeCo for all-optical magnetic recording

    Lee, M. L., Lim, C. H., Toh, K. L., Gan, C. L., Li, J. M. & Shi, L. P., 2010, Optical Data Storage 2010. 77300Q. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 7730).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages

    Kor, H. B., Chang, A. C. K. & Gan, C. L., 2010, IPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits. 5531987. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    Open Access
    2 Citations (Scopus)
  • 2009

    Effect of bonding and aging temperatures on bond strengths of Cu with 75Sn25In solders

    Sasangka, W. A., Gan, C. L., Thompson, C. V., Choi, W. K. & Wei, J., 2009, EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. p. 336-341 6 p. 5416527. (Proceedings of the Electronic Packaging Technology Conference, EPTC).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    5 Citations (Scopus)

  • Effect of temperature and bonding duration on the mechanical strength of metal-to-metal thermocompression bonds

    Made, R. I., Gan, C. L. & Yan, L., 2009, Materials Research Society Symposium Proceedings - Materials and Technologies for 3-D Integration. p. 101-106 6 p. (Materials Research Society Symposium Proceedings; vol. 1112).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • 2008

    Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds

    Made, R. I., Gan, C. L., Lee, C., Yan, L., Yu, A. & Yoon, S. W., 2008, 2008 15th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA. 4588168. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    1 Citation (Scopus)

  • Effects of nanometer-scale surface roughness and applied load on the bond strength and contact resistance of Cu-Cu bonded 3D ICs

    Leong, H. L., Gan, C. L., Thompson, C. V., Pey, K. L. & Li, H., 2008, Materials and Hyperintegration Challenges in Next-Generation Interconnect Technology. p. 14-22 9 p. (Materials Research Society Symposium Proceedings; vol. 1036).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • Effects of pulsed current on electromigration lifetime

    Lim, M. K., Gan, C. L., Tan, T. L., Ee, Y. C., Ng, C. M., Zhang, B. C. & Tan, J. B., 2008, 2008 15th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA. 4588157. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    3 Citations (Scopus)

  • Effects of pulse duration and polarity on the electromigration behavior of copper interconnects under pulsed current stress

    Lim, M. K., Gan, C. L., Ee, Y. C., Ng, C. M., Zhang, B. C. & Tan, J. B., 2008, Materials and Processes for Advanced Interconnects for Microelectronics. Materials Research Society, p. 79-84 6 p. (Materials Research Society Symposium Proceedings; vol. 1079).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • Study of Ag-In solder as low temperature wafer bonding intermediate layer

    Made, R. I., Gan, C. L., Lee, C., Yan, L. L., Yu, A., Yoon, S. W. & Lau, J. H., 2008, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII. 68840H. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6884).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    5 Citations (Scopus)
  • 2007

    Fabrication of patterned metallic nanowire array using anodic aluminum oxide for interconnection applications

    Cai, H., Gan, C. L., Ong, B. S., Li, S. Z., Ma, J., Chong, S. C., Sharma, G. & Vaidyanathan, K., 2007, Materials Science and Technology Conference and Exhibition, MS and T'07 - "Exploring Structure, Processing, and Applications Across Multiple Materials Systems". Materials Science and Technology, p. 2731-2740 10 p. (Materials Science and Technology Conference and Exhibition, MS and T'07 - "Exploring Structure, Processing, and Applications Across Multiple Materials Systems"; vol. 4).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • Localization of Cu/low-k interconnect reliability defects by pulsed laser induced technique

    Tan, T. L., Quah, A. C. T., Gan, C. L., Phang, J. C. H., Chua, C. M., Ng, C. M. & Du, A. Y., 2007, ISTFA 2007 - Proceedings of the 33rd International Symposium for Testing and Failure Analysis. p. 156-160 5 p. (Conference Proceedings from the International Symposium for Testing and Failure Analysis).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    3 Citations (Scopus)

  • Room temperature ferromagnetic Dilute magnetic semiconductor Zn 0.95Co0.05O

    Liu, Q., Gan, C. L. & Han, G. C., 2007, Materials Science and Technology Conference and Exhibition, MS and T'07 - "Exploring Structure, Processing, and Applications Across Multiple Materials Systems". Materials Science and Technology, p. 870-879 10 p. (Materials Science and Technology Conference and Exhibition, MS and T'07 - "Exploring Structure, Processing, and Applications Across Multiple Materials Systems"; vol. 2).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • Super-resolution near-field optical disk with a thermal shield layer behind recording layer

    Shi, L. P., Chong, T. C., Sze, J. Y., Li, J. M., Miao, X. S., Lim, W. H. & Gan, C. L., 2007, Optical Data Storage, ODS 2007. Optical Society of America (OSA), (Optics InfoBase Conference Papers).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • Super-resolution near-field optical disk with a thermal shield layer behind recording layer

    Shi, L. P., Chong, T. C., Sze, J. Y., Li, J. M., Miao, X. S., Lim, W. H. & Gan, C. L., 2007, Optical Data Storage 2007. 662017. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6620).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • Test structure design for precise understanding of Cu/low-k dielectric reliability

    Tan, T. L., Gan, C. L., Du, A. Y., Cheng, C. K., Ng, C. M. & Chan, L., 2007, 2007 IEEE International Reliability Physics Symposium Proceedings, 45th Annual. p. 632-633 2 p. 4227727. (Annual Proceedings - Reliability Physics (Symposium)).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    4 Citations (Scopus)
  • 2006

    Low-k dielectric breakdown improvement with Co(W,P) cap barrier

    Tam, L. T., Jesica, Chee, L. G., Nam, H. & Gambino, J., 2006, Proceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006. p. 106-109 4 p. 4017033. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • Room-temperature ferromagnetic Zn0.95Co0.05O diluted magnetic semiconducting thin films by pulsed laser deposition

    Zhang, Y., Liu, Q., Sritharan, T., Gan, C. L. & Li, S., 2006, Current and Future Trends of Functional Oxide Films. Materials Research Society, p. 18-23 6 p. (Materials Research Society Symposium Proceedings; vol. 928).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • The analysis of dielectric breakdown in Cu/low-k interconnect system

    Hwang, N., Tan, T. L., Cheng, K., Du, A. Y., Gan, C. L. & Kwong, D. L., 2006, ESSDERC 2006 - Proceedings of the 36th European Solid-State Device Research Conference. IEEE Computer Society, p. 399-402 4 p. 4099940. (ESSDERC 2006 - Proceedings of the 36th European Solid-State Device Research Conference).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  • 2005

    Distinction of intrinsic and extrinsic breakdown failure modes of Cu/low-k interconnects

    Hwang, N., Tan, T. L. & Gan, C. L., 2005, Proceedings of ESSDERC 2005: 35th European Solid-State Device Research Conference. p. 273-276 4 p. 1546638. (Proceedings of ESSDERC 2005: 35th European Solid-State Device Research Conference; vol. 2005).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    1 Citation (Scopus)

  • Electromigration reliability comparison of Cu and Al interconnects

    Alam, S. M., Wei, F. L., Gan, C. L., Thompson, C. V. & Troxel, D. E., 2005, Proceedings - 6th International Symposium on Quality Electronic Design, ISQED 2005. p. 303-308 6 p. 1410600. (Proceedings - International Symposium on Quality Electronic Design, ISQED).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    22 Citations (Scopus)
  • 2004

    Circuit level reliability analysis of Cu interconnects

    Alam, S. M., Lip, G. C., Thompson, C. V. & Troxel, D. E., 2004, Proceedings - 5th International Symposium on Quality Electronic Design, ISQUED 2004. IEEE Computer Society, p. 238-243 6 p. (Proceedings - 5th International Symposium on Quality Electronic Design, ISQUED 2004).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    24 Citations (Scopus)

  • Experiments and models for circuit-level assessment of the reliability of Cu metallization

    Thompson, C. V., Gan, C. L., Alam, S. M. & Troxel, D. E., 2004, Proceedings of the IEEE 2004 International Interconnect Technology Conference. p. 69-71 3 p. (Proceedings of the IEEE 2004 International Interconnect Technology Conference).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

    4 Citations (Scopus)
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